1. 2. 3. material content data sheet sales product name ipi80p04p4l-08 issued 29. august 2013 ma# MA000892366 package pg-to262-3-1 weight* 1571.59 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.074 0.13 0.13 1320 1320 leadframe non noble metal iron 7439-89-6 0.851 0.05 541 inorganic material phosphorus 7723-14-0 0.255 0.02 162 non noble metal copper 7440-50-8 849.682 54.08 54.15 540651 541355 wire non noble metal aluminium 7429-90-5 5.319 0.34 0.34 3385 3385 encapsulation organic material carbon black 1333-86-4 8.844 0.56 5628 plastics epoxy resin - 97.287 6.19 61904 inorganic material silicondioxide 60676-86-0 483.486 30.76 37.51 307642 375174 leadfinish non noble metal tin 7440-31-5 15.198 0.97 0.97 9670 9670 plating non noble metal nickel 7440-02-0 0.228 0.01 145 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 145 solder noble metal silver 7440-22-4 0.050 0.00 32 non noble metal tin 7440-31-5 0.040 0.00 26 non noble metal lead 7439-92-1 1.923 0.12 0.12 1224 1282 heatspreader inorganic material phosphorus 7723-14-0 0.032 0.00 20 non noble metal iron 7439-89-6 0.106 0.01 68 non noble metal copper 7440-50-8 106.210 6.76 6.77 67581 67669 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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